THERMAL MANAGEMENT
CONSUMER ELECTRONICS
Cost-effective air gap elimination with Thermal Interface Materials
Our Thermal Interface Materials offer cost-effective thermal filler gap pads and grease, heat transfer paste, gap filler and phase change materials to eliminate air gaps and reduce localized areas of high thermal resistance.
Designed for use in tablets, notebooks, smartphones, gaming systems, action cameras, set up boxes, and wearable devices.
Featured Download
PRODUCT FEATURES
- Various thermal conductivities, ultra thin bond line thickness and 0ptimal contact thermal resistance
- Low oil bleeding and outgassing, no filler separation
- Extreme thermal stability, High temperature endurance
- Excellent compressibility
- Easy to rework
- Cost effectiveness
Phase change materials (PCM) are often used as matrix materials for thermal interface applications...
Read More
Honeywell Thermal Filler Gap Pads (TGPs) provide high thermal performance with ease of use for many applications.
Read More
Honeywell silicone grease products provide superior thermal performance with ease of use across a multitude of applications.
Read More
Thermal conductivity liquid gap fillers have the benefits of shape recovery, strong material cohesion, and thermal stability.
Read More
