Cost-effective air gap elimination with Thermal Interface Materials
Our Thermal Interface Materials offer cost-effective thermal filler gap pads and grease, heat transfer paste, gap filler and phase change materials to eliminate air gaps and reduce localized areas of high thermal resistance.
Designed for use in tablets, notebooks, smartphones, gaming systems, action cameras, set up boxes, and wearable devices.
- Various thermal conductivities, ultra thin bond line thickness and 0ptimal contact thermal resistance
- Low oil bleeding and outgassing, no filler separation
- Extreme thermal stability, High temperature endurance
- Excellent compressibility
- Easy to rework
- Cost effectiveness