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IT Enterprise & Telecom

Effective heat dissipation with thermal interface materials (TIMs)

Keep Cool. Perform Better.

Our TIMs are based on proprietary technologies of polymer matrices and thermally conductive fillers to manage heat dissipation issues with long-term reliability.

IT ENTERPRISE & TELECOM

IT Enterprise

Electronic TIMs materials minimize thermal resistance at interfaces, maintain extremely stable performance, provide longer life and greater stability

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IT ENTERPRISE & TELECOM

Photo Communication

TIMs electronic materials for optical transceivers and optical modules offering various thermal conductivities and optimal contact thermal resistance

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IT ENTERPRISE & TELECOM

Telecom

Our Thermal Interface Materials offer extreme thermal stability, high temperature endurance for switches, routers, other core network facilities and base stations

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IT ENTERPRISE & TELECOM

TIMs for Semiconductor

Thermal Interface Materials for power control units (PCUs), converters, inverters, onboard electronics, electric vehicles/hybrid vehicles and batteries 

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