IT Enterprise & Telecom
Effective heat dissipation with thermal interface materials (TIMs)
Keep Cool. Perform Better.
Our TIMs are based on proprietary technologies of polymer matrices and thermally conductive fillers to manage heat dissipation issues with long-term reliability.
IT ENTERPRISE & TELECOM
IT Enterprise
Electronic TIMs materials minimize thermal resistance at interfaces, maintain extremely stable performance, provide longer life and greater stability
IT ENTERPRISE & TELECOM
Photo Communication
TIMs electronic materials for optical transceivers and optical modules offering various thermal conductivities and optimal contact thermal resistance
IT ENTERPRISE & TELECOM
Telecom
Our Thermal Interface Materials offer extreme thermal stability, high temperature endurance for switches, routers, other core network facilities and base stations
IT ENTERPRISE & TELECOM
TIMs for Semiconductor
Thermal Interface Materials for power control units (PCUs), converters, inverters, onboard electronics, electric vehicles/hybrid vehicles and batteries