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Advanced thermal management for high-powered computing

Server, Solid State Drives (SSD), and supercomputer designs require advanced heat management solutions to meet increased functionality demands. Our Thermal Interface Materials (TIMs) offer high-powered computing manufacturers the options to deliver reliable performance. 

Our phase-change materials, thermal grease, thermal gap pads and hybrid materials offer data centers, cloud computing and other enterprise IT OEMs superior heat management. 

Talk to us to learn more about our thermal management solutions for your industry.


  • Various thermal conductivities, ultra thin bond line thickness and optimal contact thermal resistance
  • Excellent compressibility
  • Low oil bleeding and outgassing, no filler separation
  • Extreme thermal stability, High temperature endurance
  • Easy to rework

Phase Change Materials

Phase change materials (PCM) are often used as matrix materials for thermal interface applications...
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Thermal Gap Pads

Honeywell Thermal Gap Pads (TGPs) provide high thermal performance with ease of use for many applications.
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Thermal Grease

Honeywell silicone grease products provide superior thermal performance with ease of use across a multitude of applications.
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Thermal One-Part Hybrids

Thermal conductivity liquid gap fillers have the benefits of shape recovery, strong material cohesion, and thermal stability.
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Thermal Two-Part Hybrids

HLT series products are two-component, dispensable thermally conductive gels, which offer long-term reliability...
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