SEMICONDUCTOR THERMAL INTERFACE MATERIALS
Heat dissipation with long-term reliability
Thermal Interface Materials (TIMs) are widely employed to manufacture the most critical parts in the heat dissipation system, to cool and protect integrated circuit (IC) chips. Our TIMs are based on proprietary technologies of polymer matrices and thermally conductive fillers, enabling them to handle challenging heat dissipation issues with long-term reliability and low cost of ownership.
Our TIMs portfolio is designed to meet the critical heat dissipation need of electronics devices.
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