THERMAL MANAGEMENT
SEMICONDUCTOR THERMAL INTERFACE MATERIALS
Heat dissipation with long-term reliability
Thermal Interface Materials (TIMs) are widely employed to manufacture the most critical parts in the heat dissipation system, to cool and protect integrated circuit (IC) chips. Our TIMs are based on proprietary technologies of polymer matrices and thermally conductive fillers, enabling them to handle challenging heat dissipation issues with long-term reliability and low cost of ownership.
Our TIMs portfolio is designed to meet the critical heat dissipation need of electronics devices.
Contact us for more information or learn more about our product offerings below.
Featured Download
Phase change materials (PCM) are often used as matrix materials for thermal interface applications...
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Honeywell Thermal Gap Filler Pads (TGPs) provide high thermal performance with ease of use for many applications.
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Honeywell Thermally Conductive Putty Pads provide high thermal performance and solid thermal reliability.
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The TIP series is Honeywell’s latest high-performance thermal conductivity and insulation material.
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Honeywell silicone grease products provide superior thermal performance with ease of use across a multitude of applications.
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