Thermal interface materials (TIMs) are widely employed to manufacture the most critical parts in the heat dissipation system, to cool and protect integrated circuit (IC) chips. Honeywell TIMs are based on proprietary technologies of polymer matrices and thermally conductive fillers, enabling them to handle challenging heat dissipation issues with long-term reliability and low cost of ownership. TIMs portfolio is designed to meet the critical needs of electronics industry.
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Phase Change Materials
Phase Change Materials (PCM) are often used as matrix materials for thermal interface applications.
Thermal Gap Filler Pads
Honeywell Thermal Gap Filler Pads (TGPs) provide high thermal performance with ease of use for many applications.
Honeywell silicone grease products provide superior thermal performance with ease of use across a multitude of applications.
The TIP series provides low thermal impedance and high insulation for high power and high voltage applications.
Thermal One-Part Hybrids
Thermal conductivity liquid gap fillers have the benefits of shape recovery, strong material cohesion, and thermal stability.
Thermal Putty Pads
Honeywell Thermally Conductive Putty Pads provide high thermal performance and solid thermal reliability.