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Thermal Interface Materials
Thermal Interface Materials

Thermal Interface Materials

As an advanced materials supplier, Honeywell has been meeting the application needs of electronic device manufacturers for more than 50 years, and we continue to provide vital materials for thermal management solutions across multiple industries.

Thermal interface materials (TIMs) are widely employed to manufacture the most critical parts in the heat dissipation system, to cool and protect integrated circuit (IC) chips. Honeywell TIMs are based on proprietary technologies of polymer matrices and thermally conductive fillers, enabling them to handle challenging heat dissipation issues with long-term reliability and low cost of ownership. TIMs portfolio is designed to meet the critical needs of electronics industry.

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