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Phase Change Materials

PCM45F Series

Phase Change Materials (PCM) are often used as matrix materials for thermal interface applications with providing a thin bond line and high reliability without pump-out issues. (2.0-2.5 W/m-K)

Phase change materials (PCM) are often used as matrix materials for thermal interface applications, because they are solid at room temperature, and soften when heated. They can fully fill the gaps of contact surfaces, therefore providing a thin bond line and high reliability without pump-out issues.Typical Applications• Power control unit, inverter, onboard electronics• IGBT• Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)• Switches, routers, base stations• Tablets, gaming, notebooks, smartphones, action cameras• LightingFeatures• High performance filler and polymer technology• Phase change at 45 ˚C• Highly conductive filler loading to optimize performance• Superior handling and rework ability• Superior reliable thermal performance• Range of thermal properties to fit different needs

Physical Properties

  • Thickness mm
    • 0.20-1.00
  • Specific Gravity
    • 2.2, Test Method ASTM D374
  • Thermal Impedance
    • 0.09-0.12 at no shim °C·cm²/W, Test Method ASTM D5470 Modified
  • Thermal Conductivity
    • 2.0-2.5 W/m-K, Test Method ASTM D5470

Electrical Properties

  • Volume Resistivity
    • 8.2x10¹⁴ ohm-cm, Test Method ASTM D258

General

  • Key Features
    • High Reliability
  • Application
    • High Reliability

Physical Properties

  • Thickness mm
    • 0.20-1.00
  • Specific Gravity
    • 2.2, Test Method ASTM D374
  • Thermal Impedance
    • 0.09-0.12 at no shim °C·cm²/W, Test Method ASTM D5470 Modified
  • Thermal Conductivity
    • 2.0-2.5 W/m-K, Test Method ASTM D5470

Electrical Properties

  • Volume Resistivity
    • 8.2x10¹⁴ ohm-cm, Test Method ASTM D258

General

  • Key Features
    • High Reliability
  • Application
    • High Reliability
  • Thickness mm : 0.20-1.00
  • Specific Gravity : 2.2, Test Method ASTM D374
  • Thermal Impedance : 0.09-0.12 at no shim °C·cm²/W, Test Method ASTM D5470 Modified
  • Thermal Conductivity : 2.0-2.5 W/m-K, Test Method ASTM D5470
  • Volume Resistivity : 8.2x10¹⁴ ohm-cm, Test Method ASTM D258
  • Key Features : High Reliability
  • Application : High Reliability
Others
Name
Description
File Size
Date
Size
Phase Change Materials: LTM6300 - PCM45F -PTM5000
application/pdf 79.35 KB
6/18/2021
79.35 KB
Name
Description
File Size
Date
Size
Phase Change Materials: LTM6300 - PCM45F -PTM5000
79.35 KB
6/18/2021
79.35 KB
Name
Description
File Size
Date
Size
Phase Change Materials: LTM6300 - PCM45F -PTM5000
79.35 KB
6/18/2021
Image
SKU
Description
alt
102753
PCM45F-CRF (14.26x8.41x0.25)MM
alt
103709
PCM45F-CRF Demo1
alt
103710
PCM45F-CRF Demo2
alt
82183
Phase Change Material PCM45F-CRF 25mmX25mmX0.25mm
alt
83190
PCM45-F w/1-Tab Plastic Liner
alt
83192
Phase Change Material PCM45F-CRF 20mmx20mmx0.25mm
alt
83648
PCM45F-CRF 15MMX15MMX0.25MM
alt
83858
PCM45-F CRF (Ext.)
alt
83898
PCM45-F
alt
83936
PCM45-F w/1-Tab (Ext.)
Image
SKU
Description
alt
102753
PCM45F-CRF (14.26x8.41x0.25)MM
alt
103709
PCM45F-CRF Demo1
alt
103710
PCM45F-CRF Demo2
alt
82183
Phase Change Material PCM45F-CRF 25mmX25mmX0.25mm
alt
83190
PCM45-F w/1-Tab Plastic Liner
alt
83192
Phase Change Material PCM45F-CRF 20mmx20mmx0.25mm
alt
83648
PCM45F-CRF 15MMX15MMX0.25MM
alt
83858
PCM45-F CRF (Ext.)
alt
83898
PCM45-F
alt
83936
PCM45-F w/1-Tab (Ext.)