Phase Change Materials
PTM7000 Series
Phase Change Materials (PCM) are often used as matrix materials for thermal interface applications with providing a thin bond line and high reliability without pump-out issues. (6.0-8.5 W/m-K)
Overview
Phase change materials (PCM) are often used as matrix materials for thermal interface applications, because they are solid at room temperature, and soften when heated. They can fully fill the gaps of contact surfaces, therefore providing a thin bond line and high reliability without pump-out issues.Typical Applications• Power control unit, inverter, onboard electronics• IGBT• Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)• Switches, routers, base stations• Tablets, gaming, notebooks, smartphones, action cameras• LightingFeatures• High performance filler and polymer technology• Phase change at 45 ˚C• Highly conductive filler loading to optimize performance• Superior handling and rework ability• Superior reliable thermal performance• Range of thermal properties to fit different needs
Specifications
Physical Properties
- Shelf Life
- 12 months Year
- Specific Gravity
- 2.7, Test Method ASTM D374
- Thickness (mm)
- 0.20-1.00
Thermal Properties
- Thermal Conductivity
- 6.0-8.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.04-0.06 at no shim °C·cm²/W, Test Method ASTM D5470 Modified
Electrical Properties
- Volume Resistivity
- 2.1x1014 ohm-cm, Test Method ASTM D259
General Information
- Typical Uses
- IGBT
- Lighting
- Power control unit, inverter, onboard electronics
- Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)
- Switches, routers, base stations
- Tablets, gaming, notebooks, smartphones, action cameras
- Key Features
- Low TI, High Reliability
- Application
- High Reliability
Physical Properties
- Shelf Life
- 12 months Year
- Specific Gravity
- 2.7, Test Method ASTM D374
- Thickness (mm)
- 0.20-1.00
Thermal Properties
- Thermal Conductivity
- 6.0-8.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.04-0.06 at no shim °C·cm²/W, Test Method ASTM D5470 Modified
Electrical Properties
- Volume Resistivity
- 2.1x1014 ohm-cm, Test Method ASTM D259
General Information
- Typical Uses
- IGBT
- Lighting
- Power control unit, inverter, onboard electronics
- Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)
- Switches, routers, base stations
- Tablets, gaming, notebooks, smartphones, action cameras
- Key Features
- Low TI, High Reliability
- Application
- High Reliability
- Shelf Life : 12 months Year
- Thermal Conductivity : 6.0-8.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance : 0.04-0.06 at no shim °C·cm²/W, Test Method ASTM D5470 Modified
- Specific Gravity : 2.7, Test Method ASTM D374
- Thickness (mm) : 0.20-1.00
- Volume Resistivity : 2.1x1014 ohm-cm, Test Method ASTM D259
- Typical Uses : IGBT|Lighting|Power control unit, inverter, onboard electronics|Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)|Switches, routers, base stations|Tablets, gaming, notebooks, smartphones, action cameras
- Key Features : Low TI, High Reliability
- Application : High Reliability
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 819.47 KB
11/8/2022
819.47 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
819.47 KB
11/8/2022
819.47 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
819.47 KB
11/8/2022
Product Number
SKUs
Image
SKU
Description
104350
PTM7000-CRF 22MMx10MMx0.20MM
Image
SKU
Description
104350
PTM7000-CRF 22MMx10MMx0.20MM
