Phase Change Materials
PTM7000 Series
Phase Change Materials (PCM) are often used as matrix materials for thermal interface applications with providing a thin bond line and high reliability without pump-out issues. (6.0-8.5 W/m-K)
Phase change materials (PCM) are often used as matrix materials for thermal interface applications, because they are solid at room temperature, and soften when heated. They can fully fill the gaps of contact surfaces, therefore providing a thin bond line and high reliability without pump-out issues.Typical Applications• Power control unit, inverter, onboard electronics• IGBT• Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)• Switches, routers, base stations• Tablets, gaming, notebooks, smartphones, action cameras• LightingFeatures• High performance filler and polymer technology• Phase change at 45 ˚C• Highly conductive filler loading to optimize performance• Superior handling and rework ability• Superior reliable thermal performance• Range of thermal properties to fit different needs
Physical Properties
- Specific Gravity
- 2.7, Test Method ASTM D374
- Thickness mm
- 0.20-1.00
- Thermal Impedance
- 0.04-0.06 at no shim °C·cm²/W, Test Method ASTM D5470 Modified
- Thermal Conductivity
- 6.0-8.5 W/m-K, Test Method ASTM D5470
Electrical Properties
- Volume Resistivity
- 2.1x10¹⁴ ohm-cm, Test Method ASTM D259
General
- Key Features
- Low TI, High Reliability
- Application
- High Reliability
Physical Properties
- Specific Gravity
- 2.7, Test Method ASTM D374
- Thickness mm
- 0.20-1.00
- Thermal Impedance
- 0.04-0.06 at no shim °C·cm²/W, Test Method ASTM D5470 Modified
- Thermal Conductivity
- 6.0-8.5 W/m-K, Test Method ASTM D5470
Electrical Properties
- Volume Resistivity
- 2.1x10¹⁴ ohm-cm, Test Method ASTM D259
General
- Key Features
- Low TI, High Reliability
- Application
- High Reliability
- Specific Gravity : 2.7, Test Method ASTM D374
- Thickness mm : 0.20-1.00
- Thermal Impedance : 0.04-0.06 at no shim °C·cm²/W, Test Method ASTM D5470 Modified
- Thermal Conductivity : 6.0-8.5 W/m-K, Test Method ASTM D5470
- Volume Resistivity : 2.1x10¹⁴ ohm-cm, Test Method ASTM D259
- Key Features : Low TI, High Reliability
- Application : High Reliability
Image
SKU
Description
104350
PTM7000-CRF 22MMx10MMx0.20MM
Image
SKU
Description
104350
PTM7000-CRF 22MMx10MMx0.20MM