Phase Change Materials
PTM7000 Series
Phase Change Materials (PCM) are often used as matrix materials for thermal interface applications with providing a thin bond line and high reliability without pump-out issues. (6.0-8.5 W/m-K)
Overview
Phase change materials (PCM) are often used as matrix materials for thermal interface applications, because they are solid at room temperature, and soften when heated. They can fully fill the gaps of contact surfaces, therefore providing a thin bond line and high reliability without pump-out issues.Typical Applications• Power control unit, inverter, onboard electronics• IGBT• Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)• Switches, routers, base stations• Tablets, gaming, notebooks, smartphones, action cameras• LightingFeatures• High performance filler and polymer technology• Phase change at 45 ˚C• Highly conductive filler loading to optimize performance• Superior handling and rework ability• Superior reliable thermal performance• Range of thermal properties to fit different needs
Specifications
Physical Properties
- Specific Gravity
- 2.7, Test Method ASTM D374
- Thickness mm
- 0.20-1.00
- Shelf Life
- 12 months Year
Thermal Properties
- Thermal Impedance
- 0.04-0.06 at no shim °C·cm²/W, Test Method ASTM D5470 Modified
- Thermal Conductivity
- 6.0-8.5 W/m-K, Test Method ASTM D5470
Electrical Properties
- Volume Resistivity
- 2.1x1014 ohm-cm, Test Method ASTM D259
General Information
- Key Features
- Low TI, High Reliability
- Application
- High Reliability
- Typical Uses
- Power control unit, inverter, onboard electronics
- IGBT
- Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)
- Switches, routers, base stations
- Tablets, gaming, notebooks, smartphones, action cameras
- Lighting
Physical Properties
- Specific Gravity
- 2.7, Test Method ASTM D374
- Thickness mm
- 0.20-1.00
- Shelf Life
- 12 months Year
Thermal Properties
- Thermal Impedance
- 0.04-0.06 at no shim °C·cm²/W, Test Method ASTM D5470 Modified
- Thermal Conductivity
- 6.0-8.5 W/m-K, Test Method ASTM D5470
Electrical Properties
- Volume Resistivity
- 2.1x1014 ohm-cm, Test Method ASTM D259
General Information
- Key Features
- Low TI, High Reliability
- Application
- High Reliability
- Typical Uses
- Power control unit, inverter, onboard electronics
- IGBT
- Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)
- Switches, routers, base stations
- Tablets, gaming, notebooks, smartphones, action cameras
- Lighting
- Specific Gravity : 2.7, Test Method ASTM D374
- Thickness mm : 0.20-1.00
- Thermal Impedance : 0.04-0.06 at no shim °C·cm²/W, Test Method ASTM D5470 Modified
- Thermal Conductivity : 6.0-8.5 W/m-K, Test Method ASTM D5470
- Shelf Life : 12 months Year
- Volume Resistivity : 2.1x1014 ohm-cm, Test Method ASTM D259
- Key Features : Low TI, High Reliability
- Application : High Reliability
- Typical Uses : Power control unit, inverter, onboard electronics|IGBT|Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)|Switches, routers, base stations|Tablets, gaming, notebooks, smartphones, action cameras|Lighting
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 819.47 KB
11/8/2022
819.47 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
819.47 KB
11/8/2022
819.47 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
819.47 KB
11/8/2022
Product Number
SKUs
Image
SKU
Description
104350
SKUs
Image
SKU
Description
104350