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Thermal Gap Filler Pads

TGP1500

Naturally tacky with better thermal performance and ease of use across a multitude of applications. (Grey color, 0.94 Thermal Impedance, 1.5 Thermal Conductivity, Thickness 0.5 - 5 mm, Hardness 40 Shore 00)

Honeywell Thermal Gap Filler Pads (TGPs) provide high thermal performance with ease of use for many applications. Ultra-high compressibility enables low stress and excellent conformity to mating surfaces. Honeywell TGP models are naturally tacky, and require no additional adhesive which could inhibit thermal performance. TGP models have been designed to minimize thermal resistance at interfaces, and maintain effective performance through reliability testing. TGP models are silicone based, therefore they offer a certain anti-shock effect, with electrical isolation and non-flammability.Typical Applications• Consumer electronics• Telecommunications & network servers• Automotive electronics• Power devices & modules• Semiconductor logic & memoryFeatures• High thermal performance• Ultra-high compressibility for low stress applications• Excellent surface wetting for low contact resistance• High reliability• Electrically insulating

Physical Properties

  • Thickness mm
    • 0.5-5, Test Method ASTM D374
  • Color
    • Grey
  • Hardness
    • 40 Shore00, Test Method ASTM D2240
  • Thermal Conductivity
    • 1.5 W/m-K, Test Method ASTM D5470
  • Specific Gravity
    • 1.8, Test Method ASTM D792
  • Thermal Impedance
    • 0.94 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470

Safety & Environment

  • Flammability
    • V-0, Test Method UL94

Electrical Properties

  • Volume Resistivity
    • 2.0x10¹³ ohm-cm, Test Method ASTM D257
  • Dielectric Constant
    • 5.5 at 1MHz, Test Method ASTM D150

General

  • Key Features
    • Cost Effectiveness
  • Application
    • High Compressibility

Physical Properties

  • Thickness mm
    • 0.5-5, Test Method ASTM D374
  • Color
    • Grey
  • Hardness
    • 40 Shore00, Test Method ASTM D2240
  • Thermal Conductivity
    • 1.5 W/m-K, Test Method ASTM D5470
  • Specific Gravity
    • 1.8, Test Method ASTM D792
  • Thermal Impedance
    • 0.94 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470

Safety & Environment

  • Flammability
    • V-0, Test Method UL94

Electrical Properties

  • Volume Resistivity
    • 2.0x10¹³ ohm-cm, Test Method ASTM D257
  • Dielectric Constant
    • 5.5 at 1MHz, Test Method ASTM D150

General

  • Key Features
    • Cost Effectiveness
  • Application
    • High Compressibility
  • Thickness mm : 0.5-5, Test Method ASTM D374
  • Color : Grey
  • Hardness : 40 Shore00, Test Method ASTM D2240
  • Thermal Conductivity : 1.5 W/m-K, Test Method ASTM D5470
  • Specific Gravity : 1.8, Test Method ASTM D792
  • Thermal Impedance : 0.94 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
  • Flammability : V-0, Test Method UL94
  • Volume Resistivity : 2.0x10¹³ ohm-cm, Test Method ASTM D257
  • Dielectric Constant : 5.5 at 1MHz, Test Method ASTM D150
  • Key Features : Cost Effectiveness
  • Application : High Compressibility
Brochure
Name
Description
File Size
Date
Size
Thermal Gap Filler Pads
application/pdf 52.38 KB
9/3/2021
52.38 KB
Thermal Interface Materials Electronics Brochure
application/pdf 4.13 MB
9/3/2021
4.13 MB
Name
Description
File Size
Date
Size
Thermal Gap Filler Pads
52.38 KB
9/3/2021
52.38 KB
Thermal Interface Materials Electronics Brochure
4.13 MB
9/3/2021
4.13 MB
Name
Description
File Size
Date
Size
Thermal Gap Filler Pads
52.38 KB
9/3/2021
Thermal Interface Materials Electronics Brochure
4.13 MB
9/3/2021