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Thermal Gap Filler Pads

TGP3000

Low hardness provides low pressure versus deflection. It is naturally tacky, and requires no additional adhesive which could inhibit thermal performance. (Yellow color, 0.65 Thermal Impedance, 3.0 Thermal Conductivity, Hardness of 40 on Shore 00)

Honeywell Thermal Gap Filler Pads (TGPs) provide high thermal performance with ease of use for many applications. Ultra-high compressibility enables low stress and excellent conformity to mating surfaces. Honeywell TGP models are naturally tacky, and require no additional adhesive which could inhibit thermal performance. TGP models have been designed to minimize thermal resistance at interfaces, and maintain effective performance through reliability testing. TGP models are silicone based, therefore they offer a certain anti-shock effect, with electrical isolation and non-flammability.Typical Applications• Consumer electronics• Telecommunications & network servers• Automotive electronics• Power devices & modules• Semiconductor logic & memoryFeatures• High thermal performance• Ultra-high compressibility for low stress applications• Excellent surface wetting for low contact resistance• High reliability• Electrically insulating

Physical Properties

  • Specific Gravity
    • 3.1, Test Method ASTM D792
  • Thermal Conductivity
    • 3.0 W/m-K, Test Method ASTM D5470
  • Color
    • Yellow
  • Thickness mm
    • 0.5-5, Test Method ASTM D374
  • Thermal Impedance
    • 0.65 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
  • Hardness
    • 40 Shore00, Test Method ASTM D2240

Electrical Properties

  • Dielectric Constant
    • 6.6 at 1MHz, Test Method ASTM D150
  • Volume Resistivity
    • 4.8x10¹³ ohm-cm, Test Method ASTM D257

Safety & Environment

  • Flammability
    • V-0, Test Method UL94

General

  • Key Features
    • Low Hardness
  • Application
    • High Compressibility

Physical Properties

  • Specific Gravity
    • 3.1, Test Method ASTM D792
  • Thermal Conductivity
    • 3.0 W/m-K, Test Method ASTM D5470
  • Color
    • Yellow
  • Thickness mm
    • 0.5-5, Test Method ASTM D374
  • Thermal Impedance
    • 0.65 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
  • Hardness
    • 40 Shore00, Test Method ASTM D2240

Electrical Properties

  • Dielectric Constant
    • 6.6 at 1MHz, Test Method ASTM D150
  • Volume Resistivity
    • 4.8x10¹³ ohm-cm, Test Method ASTM D257

Safety & Environment

  • Flammability
    • V-0, Test Method UL94

General

  • Key Features
    • Low Hardness
  • Application
    • High Compressibility
  • Specific Gravity : 3.1, Test Method ASTM D792
  • Thermal Conductivity : 3.0 W/m-K, Test Method ASTM D5470
  • Color : Yellow
  • Thickness mm : 0.5-5, Test Method ASTM D374
  • Thermal Impedance : 0.65 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
  • Hardness : 40 Shore00, Test Method ASTM D2240
  • Dielectric Constant : 6.6 at 1MHz, Test Method ASTM D150
  • Volume Resistivity : 4.8x10¹³ ohm-cm, Test Method ASTM D257
  • Flammability : V-0, Test Method UL94
  • Key Features : Low Hardness
  • Application : High Compressibility
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 4.13 MB
9/3/2021
4.13 MB
Thermal Gap Filler Pads
application/pdf 52.38 KB
9/3/2021
52.38 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
4.13 MB
9/3/2021
4.13 MB
Thermal Gap Filler Pads
52.38 KB
9/3/2021
52.38 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
4.13 MB
9/3/2021
Thermal Gap Filler Pads
52.38 KB
9/3/2021