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Thermal Gap Pads

HGP10000

Honeywell Thermal Gap Pads (TGPs) provide high thermal performance with ease of use for many applications. Ultra-high compressibility enables low stress and excellent conformity to mating surfaces.

High Compressibility Gap Filler Honeywell Thermal Gap Pads (TGPs) provide high thermal performance with ease of use for many applications. Ultra-high compressibility enables low stress and excellent conformity to mating surfaces. Honeywell TGP models are naturally tacky, and require no additional adhesive which could inhibit thermal performance. TGP models have been designed to minimize thermal resistance at interfaces, and maintain effective performance through reliability testing. TGP models are silicone based, therefore they offer a certain anti-shock effect, with electrical isolation and non-flammability. Typical Applications • Consumer electronics • Telecommunications & network servers • Automotive electronics • Power devices & modules • Semiconductor logic & memory Features • High thermal performance • Ultra-high compressibility for low stress applications • Excellent surface wetting for low contact resistance • High reliability • Electrically insulating

Physical Properties

  • Color
    • Grey
  • Shelf Life
    • 12 months
  • Hardness
    • 40 Shore00, Test Method ASTM D2240
  • Thermal Conductivity
    • 10 W/m-K, Test Method ASTM D5470
  • Thermal Impedance
    • 0.16 °C·in²/W, 1 mm at 10 psi, Test Method ASTM D5470
  • Thickness (mm)
    • 1.0-5.0mm, Test Method ASTM D374
  • Specific Gravity
    • 3.2, Test Method ASTM D792

Electrical Properties

  • Volume Resistivity
    • 2.0X1013 ohm-cm, Test Method ASTM D257
  • Dielectric Constant
    • 5.5 at 1MHz, Test Method ASTM D150

Safety & Environment

  • Flammability
    • V-0, Test Method UL94

Temperature

  • Storage Temperature
    • 0-35°C, <65%RH

Physical Properties

  • Color
    • Grey
  • Shelf Life
    • 12 months
  • Hardness
    • 40 Shore00, Test Method ASTM D2240
  • Thermal Conductivity
    • 10 W/m-K, Test Method ASTM D5470
  • Thermal Impedance
    • 0.16 °C·in²/W, 1 mm at 10 psi, Test Method ASTM D5470
  • Thickness (mm)
    • 1.0-5.0mm, Test Method ASTM D374
  • Specific Gravity
    • 3.2, Test Method ASTM D792

Electrical Properties

  • Volume Resistivity
    • 2.0X1013 ohm-cm, Test Method ASTM D257
  • Dielectric Constant
    • 5.5 at 1MHz, Test Method ASTM D150

Safety & Environment

  • Flammability
    • V-0, Test Method UL94

Temperature

  • Storage Temperature
    • 0-35°C, <65%RH
  • Color : Grey
  • Shelf Life : 12 months
  • Hardness : 40 Shore00, Test Method ASTM D2240
  • Thermal Conductivity : 10 W/m-K, Test Method ASTM D5470
  • Thermal Impedance : 0.16 °C·in²/W, 1 mm at 10 psi, Test Method ASTM D5470
  • Thickness (mm) : 1.0-5.0mm, Test Method ASTM D374
  • Specific Gravity : 3.2, Test Method ASTM D792
  • Volume Resistivity : 2.0X1013 ohm-cm, Test Method ASTM D257
  • Flammability : V-0, Test Method UL94
  • Dielectric Constant : 5.5 at 1MHz, Test Method ASTM D150
  • Storage Temperature : 0-35°C, <65%RH