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Thermal Grease

TG2800I

Honeywell silicone grease products provide superior thermal performance with ease of use across many applications. Provides low viscosity and inherent thixotropy for large-scale production with dispensing and screen and stencil printing. (2.8 W/m·K)

High Thermal Conductivity Honeywell silicone grease products provide superior thermal performance with ease of use across a multitude of applications. The low viscosity and inherent thixotropy make the technology a good fit for large-scale production with dispensing, screen printing and stencil printing. Thermal Grease is a common silicone thermal interface material, usually used to increase thermal contact conductance across jointed solid surfaces. Thermal interface materials occupy the space of air (a very poor thermal conductor) and fill in the gaps between two solid surfaces. This establishes an effective thermal path between a heat-generating component and a heat sink attached to it, greatly increasing thermal transfer efficiency.Typical Applications• CPU, GPU and chipsets• LED assemblies• Automotive electronics• IGBT & power units• Flipchip BGAs• Range of thermal properties to fit different needsFeatures• Low viscosity and excellent thixotropy for dispensing or stencil/screen printing• Range of BLT thicknesses• Thermal resistance and thermal conductivity options for different power densities• High stability and reliability• Stable and homogeneous at room temperature storage• Range of thermal properties to fit different needs

Physical Properties

  • Viscosity
    • 100000 cps at 25 °C, Test Method Brookfield Viscometer
  • Color
    • Yellow
  • Bond-Line Thickness (BLT)
    • 25 µm at 35 psi, 50 °C, Test Method HON Internal
  • Thermal Conductivity
    • 2.8 W/m-K, Test Method Hot Disk
  • Thermal Impedance
    • 0.009 °C·in²/W, 35 psi, 50 °C, Test Method ASTM D5470
  • Specific Gravity
    • 4.2, Test Method ASTM D792

Electrical Properties

  • Volume Resistivity
    • 1.3x1013 ohm-cm, Test Method ASTM D257
  • Dielectric Constant
    • >14 at 1MHz, Test Method ASTM D150

Safety & Environment

  • Flammability
    • V-0, Test Method UL94

Temperature

  • Working Temperature
    • -40-150 °C

Physical Properties

  • Viscosity
    • 100000 cps at 25 °C, Test Method Brookfield Viscometer
  • Color
    • Yellow
  • Bond-Line Thickness (BLT)
    • 25 µm at 35 psi, 50 °C, Test Method HON Internal
  • Thermal Conductivity
    • 2.8 W/m-K, Test Method Hot Disk
  • Thermal Impedance
    • 0.009 °C·in²/W, 35 psi, 50 °C, Test Method ASTM D5470
  • Specific Gravity
    • 4.2, Test Method ASTM D792

Electrical Properties

  • Volume Resistivity
    • 1.3x1013 ohm-cm, Test Method ASTM D257
  • Dielectric Constant
    • >14 at 1MHz, Test Method ASTM D150

Safety & Environment

  • Flammability
    • V-0, Test Method UL94

Temperature

  • Working Temperature
    • -40-150 °C
  • Viscosity : 100000 cps at 25 °C, Test Method Brookfield Viscometer
  • Color : Yellow
  • Bond-Line Thickness (BLT) : 25 µm at 35 psi, 50 °C, Test Method HON Internal
  • Thermal Conductivity : 2.8 W/m-K, Test Method Hot Disk
  • Thermal Impedance : 0.009 °C·in²/W, 35 psi, 50 °C, Test Method ASTM D5470
  • Specific Gravity : 4.2, Test Method ASTM D792
  • Volume Resistivity : 1.3x1013 ohm-cm, Test Method ASTM D257
  • Dielectric Constant : >14 at 1MHz, Test Method ASTM D150
  • Flammability : V-0, Test Method UL94
  • Working Temperature : -40-150 °C
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