Thermal Insulators
TIP1500
The TIP series is made with silicon resin reinforced with glass fiber, designed to be soft and conformal, which provides excellent mating surfaces for low-pressure mounting applications. (1.5 W/m·K)
Overview
The TIP series is Honeywell’s latest high-performance thermal conductivity and insulation material. It is made with silicon resin as the matrix, reinforced with glass fibers as the substrate.Typical Applications• Automotive electronics• Power conversion equipment• Power supply equipment• Motor controllers• Speaker amplifiers• Power switchesFeatures• High thermal performance• High breakdown voltage• Good resistance to tears, cut-throughs and punctures• Single side PSA available for easy assembly
Specifications
Physical Properties
- Color
- Pink
- Hardness
- 90 Shore A, Test Method ASTM D2240
- Shelf Life
- 12 months Year
- Specific Gravity
- 2.21, Test Method ASTM D792
- Thickness (mm)
- 0.19-0.23, Test Method ASTM D374
Thermal Properties
- Thermal Conductivity
- 1.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.54 at 0.19 mm, 0.93 at 0.23 mm °C·in²/W, 1 mm at 50 psi, Typical Value, Test Method ASTM D5470
- 0.91 at 0.19 mm, 0.93 at 0.23 mm °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Electrical Properties
- Dielectric Breakdown
- >6000 V, Test Method ASTM D149
- Dielectric Constant
- 5.5 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 1x1013 ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
General Information
- Application
- Electrical Isolation
- Key Features
- High Breakdown Voltage
- Typical Uses
- Motor controllers
- Power conversion equipment
- Power supply equipment
- Power switch
- Speaker amplifier
Physical Properties
- Color
- Pink
- Hardness
- 90 Shore A, Test Method ASTM D2240
- Shelf Life
- 12 months Year
- Specific Gravity
- 2.21, Test Method ASTM D792
- Thickness (mm)
- 0.19-0.23, Test Method ASTM D374
Thermal Properties
- Thermal Conductivity
- 1.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.54 at 0.19 mm, 0.93 at 0.23 mm °C·in²/W, 1 mm at 50 psi, Typical Value, Test Method ASTM D5470
- 0.91 at 0.19 mm, 0.93 at 0.23 mm °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Electrical Properties
- Dielectric Breakdown
- >6000 V, Test Method ASTM D149
- Dielectric Constant
- 5.5 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 1x1013 ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
General Information
- Application
- Electrical Isolation
- Key Features
- High Breakdown Voltage
- Typical Uses
- Motor controllers
- Power conversion equipment
- Power supply equipment
- Power switch
- Speaker amplifier
- Thickness (mm) : 0.19-0.23, Test Method ASTM D374
- Shelf Life : 12 months Year
- Hardness : 90 Shore A, Test Method ASTM D2240
- Thermal Impedance : 0.54 at 0.19 mm, 0.93 at 0.23 mm °C·in²/W, 1 mm at 50 psi, Typical Value, Test Method ASTM D5470|0.91 at 0.19 mm, 0.93 at 0.23 mm °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
- Specific Gravity : 2.21, Test Method ASTM D792
- Thermal Conductivity : 1.5 W/m-K, Test Method ASTM D5470
- Color : Pink
- Volume Resistivity : 1x1013 ohm-cm, Test Method ASTM D257
- Flammability : V-0, Test Method UL94
- Dielectric Breakdown : >6000 V, Test Method ASTM D149
- Dielectric Constant : 5.5 at 1MHz, Test Method ASTM D150
- Application : Electrical Isolation
- Typical Uses : Motor controllers|Power conversion equipment|Power supply equipment|Power switch|Speaker amplifier
- Key Features : High Breakdown Voltage
Others
Name
Description
File Size
Date
Size
Thermal Insulators: TIP1500 - TIP3500
application/pdf 87.68 KB
10/31/2023
87.68 KB
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Name
Description
File Size
Date
Size
Thermal Insulators: TIP1500 - TIP3500
87.68 KB
10/31/2023
87.68 KB
Thermal Interface Materials Electronics Brochure
820.98 KB
10/31/2023
820.98 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
820.98 KB
10/31/2023
