Thermal Insulators
TIP1500
The TIP series is made with silicon resin reinforced with glass fiber, designed to be soft and conformal, which provides excellent mating surfaces for low-pressure mounting applications. (1.5 W/m·K)
Overview
The TIP series is Honeywell’s latest high-performance thermal conductivity and insulation material. It is made with silicon resin as the matrix, reinforced with glass fibers as the substrate.Typical Applications• Automotive electronics• Power conversion equipment• Power supply equipment• Motor controllers• Speaker amplifiers• Power switchesFeatures• High thermal performance• High breakdown voltage• Good resistance to tears, cut-throughs and punctures• Single side PSA available for easy assembly
Specifications
Physical Properties
- Color
- Pink
- Specific Gravity
- 2.21, Test Method ASTM D792
- Thickness (mm)
- 0.19-0.23, Test Method ASTM D374
- Shelf Life
- 12 months Year
- Hardness
- 90 Shore A, Test Method ASTM D2240
Thermal Properties
- Thermal Conductivity
- 1.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.54 at 0.19 mm, 0.93 at 0.23 mm °C·in²/W, 1 mm at 50 psi, Typical Value, Test Method ASTM D5470
- 0.91 at 0.19 mm, 0.93 at 0.23 mm °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Electrical Properties
- Dielectric Breakdown
- >6000 V, Test Method ASTM D149
- Dielectric Constant
- 5.5 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 1x1013 ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
General Information
- Typical Uses
- Motor controllers
- Power conversion equipment
- Power supply equipment
- Power switch
- Speaker amplifier
- Key Features
- High Breakdown Voltage
- Application
- Electrical Isolation
Physical Properties
- Color
- Pink
- Specific Gravity
- 2.21, Test Method ASTM D792
- Thickness (mm)
- 0.19-0.23, Test Method ASTM D374
- Shelf Life
- 12 months Year
- Hardness
- 90 Shore A, Test Method ASTM D2240
Thermal Properties
- Thermal Conductivity
- 1.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.54 at 0.19 mm, 0.93 at 0.23 mm °C·in²/W, 1 mm at 50 psi, Typical Value, Test Method ASTM D5470
- 0.91 at 0.19 mm, 0.93 at 0.23 mm °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Electrical Properties
- Dielectric Breakdown
- >6000 V, Test Method ASTM D149
- Dielectric Constant
- 5.5 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 1x1013 ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
General Information
- Typical Uses
- Motor controllers
- Power conversion equipment
- Power supply equipment
- Power switch
- Speaker amplifier
- Key Features
- High Breakdown Voltage
- Application
- Electrical Isolation
- Color : Pink
- Thermal Conductivity : 1.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance : 0.54 at 0.19 mm, 0.93 at 0.23 mm °C·in²/W, 1 mm at 50 psi, Typical Value, Test Method ASTM D5470|0.91 at 0.19 mm, 0.93 at 0.23 mm °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
- Specific Gravity : 2.21, Test Method ASTM D792
- Thickness (mm) : 0.19-0.23, Test Method ASTM D374
- Shelf Life : 12 months Year
- Hardness : 90 Shore A, Test Method ASTM D2240
- Dielectric Breakdown : >6000 V, Test Method ASTM D149
- Dielectric Constant : 5.5 at 1MHz, Test Method ASTM D150
- Volume Resistivity : 1x1013 ohm-cm, Test Method ASTM D257
- Flammability : V-0, Test Method UL94
- Typical Uses : Motor controllers|Power conversion equipment|Power supply equipment|Power switch|Speaker amplifier
- Key Features : High Breakdown Voltage
- Application : Electrical Isolation
Others
Name
Description
File Size
Date
Size
Thermal Insulators: TIP1500 - TIP3500
application/pdf 103.48 KB
11/8/2022
103.48 KB
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 819.47 KB
11/8/2022
819.47 KB
Name
Description
File Size
Date
Size
Thermal Insulators: TIP1500 - TIP3500
103.48 KB
11/8/2022
103.48 KB
Thermal Interface Materials Electronics Brochure
819.47 KB
11/8/2022
819.47 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
819.47 KB
11/8/2022
