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Thermal One-Part Hybrids

HT4500

Thermal conductivity liquid gap fillers have the benefits of shape recovery, strong material cohesion, and good long-term thermal stability — they also offer a very low thermal resistance comparable to thermal grease, and can fill gaps at interfaces.

One-Part Dispensable Very Low Compression Force Thermal conductivity liquid gap fillers not only have the benefits of shape recovery, strong material cohesion, and good long-term thermal stability — they also offer a very low thermal resistance comparable to thermal grease, and can fill gaps at interfaces. Hybrid is a substance between liquid and solid, combining the advantages of thermal grease and thermal gap pad. Typical Applications • Consumer electronics • Telecommunications equipment • Automotive electronics • Power supplies & semiconductors • Memory & power modules • Power electronics Features • High thermal performance and low contact resistance • Easily dispensable and reworkable • High compressibility for low stress applications Long-term reliability • No pump-out or cracking risk • Reduced oil separation • Requires no mixing, additional curing or low temperature storage

Physical Properties

  • Color
    • Green
  • Cure Schedule
    • Pre-cured
  • Shelf Life
    • 12 months
  • Thermal Conductivity
    • 4.5 W/m-K, Test Method, ASTM D5470
  • Specific Gravity
    • 3.3, Test Method ASTM D792

Electrical Properties

  • Volume Resistivity
    • >1.0X1013 ohm-cm, Test Method ASTM D257
  • Dielectric Strength
    • 5 KV/mm, Test Method D149

Temperature

  • Storage Temperature
    • RT

Other

  • Other Notes
    • Silicone-based

Physical Properties

  • Color
    • Green
  • Cure Schedule
    • Pre-cured
  • Shelf Life
    • 12 months
  • Thermal Conductivity
    • 4.5 W/m-K, Test Method, ASTM D5470
  • Specific Gravity
    • 3.3, Test Method ASTM D792

Electrical Properties

  • Volume Resistivity
    • >1.0X1013 ohm-cm, Test Method ASTM D257
  • Dielectric Strength
    • 5 KV/mm, Test Method D149

Temperature

  • Storage Temperature
    • RT

Other

  • Other Notes
    • Silicone-based
  • Color : Green
  • Cure Schedule : Pre-cured
  • Shelf Life : 12 months
  • Thermal Conductivity : 4.5 W/m-K, Test Method, ASTM D5470
  • Specific Gravity : 3.3, Test Method ASTM D792
  • Volume Resistivity : >1.0X1013 ohm-cm, Test Method ASTM D257
  • Dielectric Strength : 5 KV/mm, Test Method D149
  • Storage Temperature : RT
  • Other Notes : Silicone-based